![[Data] Shirutoku Report 117 #Heat Warping Caused by Temperature Changes](https://image.www.ipros.com/public/product/image/386624/IPROS9232532613512863828.jpg?w=280&h=280)
[Data] Shirutoku Report 117 #Heat Warping Caused by Temperature Changes
Heat distortion can be predicted. Design issues can be prevented through simulation.
★★Shirutoku Report: Useful Information You Should Know★★ One of the challenges that cannot be overlooked in electronic components and circuit board design is deformation caused by heat. This time, we will discuss thermal warping that occurs due to temperature changes in multilayer structures with different materials in each layer.
- Company：Wave Technology
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